View NUF6410MNT1G_4132338.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

NUF6410MN 6 Line EMI Filter with ESD Protection
This device is a 6 line EMI filter array for wireless applications. Greater than -20 dB typical attenuation is obtained at frequencies from 800 MHz to 3.0 GHz. The NUF6410MN has a typical cut-off frequency of 250 MHz. This DFN package is specifically designed to enhance EMI filtering for low-profile or slim design electronics especially where space and height is a premium. It also offers ESD protection clamping transients from static discharges. ESD protection is provided across all capacitors.
Features http://onsemi.com
1 Cd Cd 12
* * * * * * * * * * * * * * * *
2 Cd Cd
11
EMI Filtering and ESD Protection Integration of 30 Discrete Components DFN Package, 1.35 x 3.0 mm Moisture Sensitivity Level 1 ESD Ratings: IEC61000-4-2 (Level 4) Machine Model = C Human Body Model = 3B This is a Pb-Free Device* Reduces EMI/RFI Emissions on a Data Line Integrated Solution Offers Cost and Space Savings in a DFN Package Excellent S21 Characteristics with very Low Parasitic Inductances Integrated Solution Improves System Reliability Compatible Footprint to BGA or Flip-Chip Package EMI Filtering and ESD Protection for Data Lines Wireless Phones PDAs and Handheld Products Digital Camera LCD Displays
3 Cd Cd
10
4 Cd Cd
9
Benefits
5 Cd Cd
8
6 Cd Cd
7
Applications
(Top View)
MARKING DIAGRAM
1 12 DFN12 CASE 506AD 1 64 10 MG G
1
2
3
4
5
6
GND
6410 = Specific Device Code = Date and Assembly Location M G = Pb-Free Package (Note: Microdot may be in either location)
12
11
10 9 8 (Bottom View)
7
ORDERING INFORMATION
Device NUF6410MNT1G Package DFN12 (Pb-Free) Shipping 3000 / Tape & Reel
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2007
1
October, 2007 - Rev. 2
Publication Order Number: NUF6410MN/D
NUF6410MN
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Parameter ESD Discharge IEC61000-4-2 Contact Discharge DC Power per Resistor DC Power per Package Operating Temperature Range Storage Temperature Range Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) PR PT TOP TSTG TL Symbol VPP 8.0 100 600 -40 to 85 -55 to 150 260 mW mW C C C Value Unit kV
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Parameter Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Resistance Capacitance (Notes 1 and 2) Cut-Off Frequency (Note 3) Symbol VRWM VBR IR RA Cd f3dB IR = 1.0 mA VRWM = 3.3 V IR = 20 mA VR = 2.5 V, f = 1.0 MHz Above this frequency, appreciable attenuation occurs 85 6.0 7.0 10 100 7.0 250 100 115 9.0 Test Conditions Min Typ Max 5.0 Unit V V nA W pF MHz
1. Measured at 25C, VR = 2.5 V, f = 1.0 MHz. 2. Total line capacitance is 2 times the Diode Capacitance (Cd). 3. 50 W source and 50 W load termination.
http://onsemi.com
2
NUF6410MN
0 -5 -10 -15 S21 (dB) -20 -25 -30 -35 -40 -45 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 S41 (dB) 0 -10 -20 -30 -40 -50 -60 -70 -80 1.E+06 1.E+07 1.E+08 1.E+09 1.E
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 1. Typical Insertion Loss Characteristic
Figure 2. Typical Analog Crosstalk
2
110 108
NORMALIZED CAPACITANCE
1.5
106 RESISTANCE (W)
0 1 2 3 4 5
104 102 100 98 96 94 92
1
0.5
0
90 -40
-20
REVERSE VOLTAGE (V)
0 20 40 TEMPERATURE (C)
60
80
Figure 3. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance, Cd @ 2.5 V)
Figure 4. Typical Resistance over Temperature
http://onsemi.com
3
NUF6410MN
PACKAGE DIMENSIONS
2X
DFN12 3.0x1.35, 0.5P CASE 506AD-01 ISSUE G
0.15 C
A B
D (A3)
E
2X
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED PADS CONNECTED TO DIE FLAG. USED AS TEST CONTACTS. MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 3.00 BSC 2.10 2.30 1.35 BSC 0.20 0.40 0.50 BSC 0.20 --0.20 0.40
0.15 C
PIN ONE REFERENCE
TOP VIEW
EXPOSED Cu
0.10 C
12 X
(A3) A
0.08 C
2X 0.2 X 0.25 MM NOTE 5 12 X
SIDE VIEW A1 D2
1
SEATING PLANE
DIM A A1 A3 b D D2 E E2 e K L
C
SOLDERING FOOTPRINT*
EXPOSED PAD 6
L
e
E2 0.351 0.014
12 X
2.352 0.093
12 X K
12
7
b 0.10 C A B 0.05 C
NOTE 3
BOTTOM VIEW
0.265 0.01
0.479 0.019
SCALE 16:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
4
NUF6410MN/D

▲Up To Search▲

Price & Availability of NUF6410MNT1G

	To Download NUF6410MNT1G Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .